Oct 26 (Reuters) – Applied Materials said on Monday it plans to raise its stake in Dutch company BE Semiconductor Industries (BESI) to about 20% from 9%, deepening a partnership focused on advanced chip-packaging technologies used in AI applications.
Here are more details:
• Applied Materials, BESI’s largest shareholder since buying a 9% stake in April 2025, said it entered into an accelerated share purchase agreement for the semiconductor equipment maker’s additional shares, subject to US antitrust review
• The expanded partnership will focus on new chip-connection and packaging technologies aimed at supporting next-generation AI semiconductors
• Applied Materials said it does not plan to raise its stake beyond about 20% or seek board representation at BESI
• The companies have collaborated since 2020 on hybrid bonding technology, a key advanced packaging technique used in high-performance chips
(Reporting by Siddhi Mahatole in Bengaluru; Editing by Shreya Biswas)
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